![]() |
 |
 |
|
 |
|
 |
 |
The following video is to introduce the Marking Machine Operation Record. |
|
|
 |
| Printing & Testing Packaging Machine MIU-08 |
|
| High-Speed, Precision, and Smart Solution for Electronic Component Printing & Packaging |
|
| The MIU-08 is a comprehensive printing and packaging solution designed specifically for mass production of electronic components. Whether it’s passive components (MLCC, inductors, capacitors, resistors), LEDs, quartz oscillators, or ICs, the MIU-08 delivers up to 200 pcs/min production capacity, combined with advanced inspection and automated packaging functions, making your production line faster, more stable, and smarter. |
|
 |
|
| • |
High-Speed Productivity:Up to 200 pieces per minute, dramatically boosting production efficiency. |
| • |
Smart Vision Inspection:CCD system monitors font position, line width, and density in real time, ensuring flawless results. |
| • |
Component Protection:Buffer transfer design prevents collision damage, guaranteeing consistent quality. |
| • |
Accurate Printing Control:Constant-pressure mechanism adapts to component size differences, maintaining uniform printing quality. |
| • |
Flexible Adjustment:Independent adjustment of print head height, lateral movement, and angle to meet diverse requirements. |
| • |
Optional Testing Station:Integrate testing instruments to verify component performance and reliability. |
| • |
Reusable Feeding & Packaging Tape:Reduce costs and maximize efficiency with a circular supply design. |
| • |
Multiple Feeding Options:Supports feeder + P&P + direct vibration tape, or vibration bowl bulk feeding, adapting to different production modes. |
|
 |
|
| Choosing the MIU-08 means more than investing in a machine — it’s about equipping your production line with high performance, zero-defect, and intelligent productivity. It shortens process time while ensuring the quality and reliability of every electronic component, helping your products stand out in the market. |
|
| |
| |
 |
 |
 |
| • |
Buffered Transfer Design:Prevents damage from collisions, ensuring consistent marking quality. |
| • |
CCD Visual Inspection:Monitors printing accuracy, including position, line width, and ink density. |
| |
• Components on the rotary table:NG parts are automatically rejected into the NG bin.
• Components on the packaging tape: NG parts are replaced manually. |
|
 |
 |
| • |
Constant-Pressure Printing Head:Maintains balanced printing pressure despite component size variations. |
| • |
Adjustable Printing Head Mechanism:Independent adjustment of height, lateral movement, and θ angle of the letter mold's holder. |
| • |
Optional Testing Station:Can be equipped with testing instruments to verify component performance. |
| • |
Interchangeable Supply & Packaging Tapes:Responding to plastic reduction and environmental protection. |
 |
 |
| • |
Flexible Feeding Options: |
| |
• Feeder + P&P (Pick & Place) + Vibration tape.
• Vibratory feeder. |
|
|
 |
 |
| * |
A variety of feeding modules can be customized. |
|
 |
|
 |
 |
 |
 |
| MIU-08 Printing & Testing Packaging Machine |
 |
| Applicable Range |
Products with character height ≥ 0.3 mm.
0603、0805、1206、1210、1812、2220 |
 |
 |
| Throughput |
Max. 200 pcs/min (inspection time < 80 ms/pcs) |
| Marking Material |
UV ink |
| Curing Method |
LED UV Curing module |
| Feeding Mechanism |
Tape feeding / Vibratory feeder (choose one) |
| Machine Dimensions (L*W*H) |
190 × 110 × 220 cm |
| Machine Weight |
Approx. 300 kg |
| Power Supply |
1Ø , AC 220 V , 50 / 60 Hz |
| Air Pressure |
4 ~ 6 kg / c㎡ |
|
 |
|
 |
 |
 |
• Passive components: MLCC, inductors, capacitors, resistors.
• Active components: LEDs, quartz oscillators, ICs.
• Ideal for marking and packaging across diverse electronic components. |
|
 |
|
 |
 |
 |
| We provide a complete consumable supply system, including : |
• Letter molds
• Rollers
• Ink cup |
|
|
 |
 |
 |
 |
 |
|
|
![]() |
| |
 |
| Coating & Marking Equipments Manufacturer, |
| Electronic, Hardware's Coating & Marking Total Solution, |
| Coating & Marking Consumables,Rubber Letter Mold Manufacturing. |
| Coating Equipment coat with Silver glue, Solder paste, and EPOXY. |
| SMT SMD's Coating Machine,Piezoelectric Ceramic's Coating Machine, |
| Screwdriver Head's Pad Printing Machine ,Screwdriver Head's Coating. |
| MLCC's Stamping Machine,Automotive Diode's Color Ring Stamping. |
| PCB's Screen Printing Machine,IC's Screen Printing Machine, |
| Fuse's Transfer-printing Machine,Discharge Tube's Transfer-printing. |
|
|
|